Parameters | |
---|---|
Series | MAX® 10 |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
RoHS Status | RoHS Compliant |
Package / Case | 169-LFBGA |
Mfr | Intel |
Mounting Type | Surface Mount |
Operating Temperature | 0°C ~ 85°C (TJ) |
Supplier Device Package | 169-UBGA (11x11) |
Number of I/O | 130 |
Voltage - Supply | 2.85V ~ 3.465V |
Number of Logic Elements/Cells | 2000 |
Number of LABs/CLBs | 125 |
Total RAM Bits | 110592 |
Package | Tray |
Product Status | Active |
Conevo-Key Programmable | Not Verified |
REACH Status | REACH Unaffected |
Standard Package | 176 |
ECCN | EAR99 |
HTSUS | 8542.39.0001 |
The Intel 10M02SCU169C8G is a member of the Intel® MAX® 10 FPGA family, which was launched in 2014. This FPGA is fabricated using a 55 nm lithography process,
offering a compact and efficient solution for a variety of digital design needs.
10M02SCU169C8G Features:
The 10M02SCU169C8G boasts 2000 logic elements (LE), which provide the foundational building blocks for digital logic functions. It includes 2 fabric and I/O Phase
-Locked Loops (PLLs) for precise clock management, and a maximum of 108 Kb of embedded memory. This FPGA is designed to handle digital signal processing with
its Multiply DSP format. It also features user-flashable memory and internal configuration storage, allowing for flexible and customizable non-volatile storage solutions.
10M02SCU169C8G Applications:
The Intel 10M02SCU169C8G FPGA is suited for a wide range of applications due to its robust I/O capabilities. With a maximum of 246 user I/O count and support for
various I/O standards including LVDS, PCI, SSTL, and more, it can be integrated into complex systems requiring high-speed data transfer and signal integrity. This FPGA
is ideal for applications in digital systems, communication equipment, industrial control, automotive electronics, and other areas where high-performance programmable
logic is essential.