Intel 10M04DAF256C8G
| Parameters | |
|---|---|
| Series | MAX® 10 |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| RoHS Status | RoHS Compliant |
| Package / Case | 256-LBGA |
| Mfr | Intel |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Supplier Device Package | 256-FBGA (17x17) |
| Number of I/O | 178 |
| Voltage - Supply | 1.15V ~ 1.25V |
| Number of Logic Elements/Cells | 4000 |
| Number of LABs/CLBs | 250 |
| Total RAM Bits | 193536 |
| Package | Tray |
| Product Status | Active |
| Conevo-Key Programmable | Not Verified |
| REACH Status | REACH Unaffected |
| Standard Package | 90 |
| ECCN | 3A991D |
| HTSUS | 8542.39.0001 |
MAX® 10 Field Programmable Gate Array (FPGA) IC 178 193536 4000 256-LBGA
10M04DAF256C8G Description
Efficient integration and reduced IC space in 256 lbga package and surface mount. The 10M04DAF256C8G is a field programmable gate array (FPGA) for the MAX®10 series. The FPGA has 250 lab/CLBS and 4000 logic elements/units. To ensure efficient power use, the supply voltage is 1.15V to 1.25V. The IC also has 193,536 RAM bits and 178 I/ OS to meet a variety of peripheral device connectivity needs and ensure efficient data processing. The equipment shall operate within the applicable range of 0°C to 85°C (TJ).
Features
MAX® 10 Field Programmable Gate Array (FPGA) IC
178 I/O ports 193536 RAM Bits 4000 Logic Elements/Cells
256-LBGA Package
Applications
5G wireless
Data center
Wireless communication
AI intelligence
Automated industry
Medical science field
