Intel AGFB023R25A3E4X

AGFB023R25A3E4X


  • Manufacturer: Intel
  • CONEVO NO: AGFB023R25A3E4X
  • Package: -
  • Datasheet: PDF
  • Stock: In stock
  • Description: AGFB023R25A3E4X(Kg)

Details

Tags

Parameters
Mfr Intel
Series Agilex F
Package Tray
Product Status Active
Architecture MPU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 1.4GHz
Primary Attributes FPGA - 2.3M Logic Elements
Operating Temperature 0°C ~ 100°C (TJ)
Package / Case -
Supplier Device Package -
Number of I/O 480
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Other Names 544-AGFB023R25A3E4X
Standard Package 1
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point System On Chip (SOC) IC Agilex F FPGA - 2.3M Logic Elements 1.4GHz
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