Intel AGFB023R31C2I3V

AGFB023R31C2I3V


  • Manufacturer: Intel
  • CONEVO NO: AGFB023R31C2I3V
  • Package: 3184-BFBGA Exposed Pad
  • Datasheet: -
  • Stock: In stock
  • Description: AGFB023R31C2I3V(Kg)

Details

Tags

Parameters
Mfr Intel
Series Agilex F
Package Tray
Product Status Active
Architecture MPU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 1.4GHz
Primary Attributes FPGA - 2.3M Logic Elements
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 3184-BFBGA Exposed Pad
Supplier Device Package 3184-BGA (56x45)
Number of I/O 480
Other Names 544-AGFB023R31C2I3V
Standard Package 1
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point System On Chip (SOC) IC Agilex F FPGA - 2.3M Logic Elements 1.4GHz 3184-BGA (56x45)
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