Intel EP1C12F256C6N
| Parameters | |
|---|---|
| Series | Cyclone® |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Package / Case | 256-BGA |
| Mfr | Intel |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Supplier Device Package | 256-FBGA (17x17) |
| Number of I/O | 185 |
| Voltage - Supply | 1.425V ~ 1.575V |
| Number of Logic Elements/Cells | 12060 |
| Number of LABs/CLBs | 1206 |
| Total RAM Bits | 239616 |
| Package | Tray |
| Product Status | Obsolete |
| Conevo-Key Programmable | Not Verified |
| Base Product Number | EP1C12 |
| Standard Package | 90 |
| ECCN | 3A991D |
| HTSUS | 8542.39.0001 |
The Intel EP1C12F256C6N is a Field Programmable Gate Array (FPGA) developed by Intel. It falls under the category of semiconductor programmable devices and is specifically a type of programmable logic device. This component adheres to industry standards such as EU RoHS, with the RoHS version being 2011/65/EU, 2015/863, and has an ECCN of 3A991.
Intel's Cyclone® FPGA IC EP1C12F256C6N Features
The EP1C12F256C6N FPGA is known for its versatility and reconfigurability, allowing engineers to program the device for specific applications. It operates within a supply voltage range of 1.425V to 1.575V and is designed to work within a temperature range of 0°C to 85°C (TJ). The device is surface mountable, with a 256-BGA package type, which is suitable for PCB integration. It contains 185 I/O pins, 1206 LABs/CLBs, and 12060 logic elements/cells, providing a robust platform for complex digital designs. The total RAM bits available in this FPGA is 239616, which allows for substantial data handling capabilities.
EP1C12F256C6N Applications
The Intel EP1C12F256C6N FPGA is widely used in various applications due to its programmable nature, which enables customization for specific tasks. It is commonly employed in digital signal processing, communication systems, image processing, and other areas where high-speed data manipulation and parallel processing are required. Its ability to be reprogrammed makes it an ideal choice for rapid prototyping and development in the electronics industry. The device's I/O flexibility and logic capacity make it suitable for a broad range of embedded systems and complex control applications.
