Intel EP1C4F324C6N
| Parameters | |
|---|---|
| Series | Cyclone® |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Package / Case | 324-BGA |
| Mfr | Intel |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Supplier Device Package | 324-FBGA (19x19) |
| Number of I/O | 249 |
| Voltage - Supply | 1.425V ~ 1.575V |
| Number of Logic Elements/Cells | 4000 |
| Number of LABs/CLBs | 400 |
| Total RAM Bits | 78336 |
| Package | Tray |
| Product Status | Obsolete |
| Conevo-Key Programmable | Not Verified |
| Base Product Number | EP1C4 |
| Standard Package | 84 |
| ECCN | 3A991D |
| HTSUS | 8542.39.0001 |
The Intel EP1C4F324C6N is a Cyclone® I Field Programmable Gate Array (FPGA) IC designed for embedded applications. It features 4,000 logic elements, 249 I/O pins, and a maximum clock frequency of 405.2 MHz. The device is manufactured using 130nm process technology and operates at a supply voltage of 1.5V. It is packaged in a 324-pin Fine Ball Grid Array (FBGA) format, making it suitable for high-density and compact designs.
Features of Intel EP1C4F324C6N
The EP1C4F324C6N offers a range of advanced features that make it highly versatile for various applications. It supports multiple I/O standards, including LVDS at data rates up to 640 Mbps, as well as 66- and 33-MHz, 64- and 32-bit peripheral component interfaces. The FPGA also includes phase-locked loops (PLLs) for clock management and a dedicated double data rate (DDR) interface to meet the requirements of DDR SDRAM and fast cycle RAM (FCRAM) memory. These features enable high-speed data processing and efficient memory management, making it ideal for complex digital systems.
Applications of Intel EP1C4F324C6N
The EP1C4F324C6N is widely used in various industries and applications due to its flexibility and performance. It is commonly found in embedded systems, industrial control, and communication equipment. The device's ability to support multiple I/O standards and high-speed data processing makes it suitable for applications such as digital signal processing, control systems, and data acquisition. Additionally, its compact form factor and high-density packaging make it ideal for space-constrained designs, further expanding its application scope in consumer electronics and automotive systems.
Choosing the EP1C4F324C6N offers several advantages. Its high logic element count and I/O capacity provide ample resources for complex designs, while the advanced I/O standards support ensures compatibility with a wide range of peripheral devices. The device's 130nm process technology and 1.5V supply voltage contribute to low power consumption, making it energy-efficient for battery-powered and portable applications. Furthermore, the availability of comprehensive development tools and support from Intel ensures ease of use and quick time-to-market for new products.
