Intel EP1C6F256C6N

EP1C6F256C6N


  • Manufacturer: Intel
  • CONEVO NO: EP1C6F256C6N
  • Package: 256-BGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: EP1C6F256C6N(Kg)

Details

Tags

Parameters
Series Cyclone®
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Package / Case 256-BGA
Mfr Intel
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Supplier Device Package 256-FBGA (17x17)
Number of I/O 185
Voltage - Supply 1.425V ~ 1.575V
Number of Logic Elements/Cells 5980
Number of LABs/CLBs 598
Total RAM Bits 92160
Package Tray
Product Status Obsolete
Conevo-Key Programmable Not Verified
Base Product Number EP1C6
Standard Package 90
ECCN 3A991D
HTSUS 8542.39.0001

The Intel EP1C6F256C6N is a Cyclone series FPGA (Field Programmable Gate Array) from Intel, featuring a 256-pin FBGA package. It is based on a 1.5-V, 0.13-μm, all-layer copper SRAM process, with densities up to 20,060 logic elements (LEs) and up to 288 Kbits of RAM. This device is known for its cost-effective solution for data-path applications, offering a balance of performance and power efficiency.

Cyclone® Field Programmable Gate Array EP1C6F256C6N Features

The Cyclone EP1C6F256C6N boasts several advanced features that make it suitable for a wide range of applications. It includes up to 294,912 RAM bits (36,864 bytes), supports configuration through low-cost serial configuration devices, and is compatible with various I/O standards including LVTTL, LVCMOS, SSTL-2, and SSTL-3. It also supports high-speed (640 Mbps) LVDS I/O and low-speed (311 Mbps) LVDS I/O. The device includes up to two PLLs per device for clock multiplication and phase shifting, and supports external memory interfaces such as DDR SDRAM (133 MHz), FCRAM, and SDR SDRAM. It also supports multiple intellectual property (IP) cores, including Altera MegaCore functions and Altera Megafunctions Partners Program (AMPP) megafunctions.

EP1C6F256C6N Applications

The EP1C6F256C6N is widely used across various fields due to its versatility and performance. It finds applications in Artificial Intelligence, 5G Technology, Cloud Computing, Consumer Electronics, Wireless Technology, Industrial Control, Internet of Things, and Medical Equipment. Its ability to handle complex data processing and its adaptability make it a preferred choice in these domains.

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