Intel EP2AGX65DF29I3NAA
| Parameters | |
|---|---|
| Series | Arria II GX |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Package / Case | 780-BBGA, FCBGA |
| Mfr | Intel |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Supplier Device Package | 780-FBGA (29x29) |
| Number of I/O | 364 |
| Voltage - Supply | 0.87V ~ 0.93V |
| Number of Logic Elements/Cells | 60214 |
| Number of LABs/CLBs | 2530 |
| Total RAM Bits | 5371904 |
| Package | Tray |
| Product Status | Obsolete |
| Conevo-Key Programmable | Not Verified |
| Other Names | 969474 |
| Standard Package | 1 |
| ECCN | OBSOLETE |
| HTSUS | 0000.00.0000 |
The Intel EP2AGX65DF29I3NAA is a Field-Programmable Gate Array (FPGA) from Intel's Programmable Solutions Group. It features a 780-BBGA or FCBGA 780-FBGA (29x29) packaging, making it suitable for a range of applications that require high integration and flexibility. The device is compliant with RoHS standards, ensuring environmental friendliness during production and disposal. With a manufacturer part number of EP2AGX65DF29I3N, it is recognized for its versatility and performance in various electronic systems.
Intel EP2AGX65DF29I3NAA Characteristics
The EP2AGX65DF29I3NAA FPGA boasts an impressive array of features that set it apart. It offers 2530 LAB/CLB (Logic Array Block/Configurable Logic Block) elements, providing ample resources for complex logic designs. Additionally, it contains 60,214 logic elements or units, ensuring high computational power. The total RAM bits amount to 5,371,904, supporting extensive data storage and processing capabilities. With 364 I/O (Input/Output) ports, the FPGA can interface with a wide range of external devices and peripherals. Furthermore, it operates within a voltage range of 0.87 V to 0.93 V and can withstand temperatures ranging from -40°C to 100°C (TJ), making it suitable for demanding environments.
Intel EP2AGX65DF29I3NAA Applications
The versatility of the EP2AGX65DF29I3NAA FPGA makes it ideal for a multitude of applications. Due to its high integration, flexibility, and performance, it is often used in fields such as cloud computing, enterprise systems, testing and measurement equipment, as well as audio, video, and broadcasting systems. Its ability to support complex logic designs and extensive I/O connectivity makes it a valuable component in systems that require high data throughput and low latency. Additionally, its compliance with RoHS standards ensures that it can be used in environmentally conscious applications, contributing to sustainable development efforts.
