Intel EP3SE260F1152C4N

EP3SE260F1152C4N


  • Manufacturer: Intel
  • CONEVO NO: EP3SE260F1152C4N
  • Package: 1152-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: In stock
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Tags

Parameters
Series Stratix® III E
Moisture Sensitivity Level (MSL) 4 (72 Hours)
RoHS Status RoHS Compliant
Package / Case 1152-BBGA, FCBGA
Mfr Intel
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Supplier Device Package 1152-FBGA (35x35)
Number of I/O 744
Voltage - Supply 0.86V ~ 1.15V
Number of Logic Elements/Cells 255000
Number of LABs/CLBs 10200
Total RAM Bits 16672768
Package Tray
Product Status Obsolete
Conevo-Key Programmable Not Verified
Base Product Number EP3SE260
Standard Package 24
ECCN 3A001A7A
HTSUS 8542.39.0001

The Intel EP3SE260F1152C4N is a high-performance, low-power FPGA (field-Programmable Gate Array) chip belonging to the Stratix III E family. The chip uses a 65nm process technology with 10,200 logic array blocks (LABs) and 744 I/O pins, packaged as a 1152-pin FBGA (Pin-less Ball Grid Array). Its operating temperature range is 0°C to +85°C and is suitable for a wide range of industrial and commercial applications.

EP3SE260F1152C4N Features

  1. Memory resources: Provides up to 14.6 Mbit of embedded block memory (EBR) to support complex storage requirements.

  2. High-speed DSP module: With high-speed digital signal processing (DSP) module, support 9×9, 12×12, 18×18 and 36×36 multiplier, up to 550 MHz operating frequency.

  3. Low Power design: Intel's Programmable Power Technology enables performance to be turned on when needed while reducing the power consumption of unused modules.

  4. Signal integrity: I/O: GND: PWR ratio is 8:1:1, and has on-chip and package decoupling to ensure signal integrity.

EP3SE260F1152C4N Application

The EP3SE260F1152C4N chip is widely used in many fields, including:

  • Artificial Intelligence: Used to accelerate machine learning and deep learning algorithms.

  • 5G technology: Support for signal processing in 5G communications infrastructure.

  • Cloud computing: Efficient data processing and storage in the data center.

  • Industrial control: Used in automated control systems and Industrial Internet of Things (IIoT) devices.

  • Medical equipment: Supports medical image processing and diagnostic equipment.

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