Lattice Semiconductor Corporation ORSPI4-3F1156C

ORSPI4-3F1156C


  • Manufacturer: Lattice Semiconductor Corporation
  • CONEVO NO: ORSPI4-3F1156C
  • Package: 1156-BBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: ORSPI4-3F1156C(Kg)

Details

Tags

Parameters
Mfr Lattice Semiconductor Corporation
Series ORCA® ORSPI4
Package Bulk
Product Status Active
Architecture MPU, FPGA
Core Processor SPI4
Flash Size -
RAM Size -
Peripherals LVD
Connectivity FIFO
Speed 250MHz
Primary Attributes FPGA - 15K Logic Elements
Operating Temperature -40°C ~ 125°C (TJ)
Package / Case 1156-BBGA
Supplier Device Package 1156-FPBGA (35x35)
Number of I/O 356
RoHS Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Affected
ECCN 3A991D
HTSUS 8542.39.0001
Standard Package 1
SPI4 System On Chip (SOC) IC ORCA® ORSPI4 FPGA - 15K Logic Elements 250MHz 1156-FPBGA (35x35)
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