Microchip Technology A2F200M3F-FGG256I

A2F200M3F-FGG256I


  • Manufacturer: Microchip Technology
  • CONEVO NO: A2F200M3F-FGG256I
  • Package: 256-LBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: A2F200M3F-FGG256I(Kg)

Details

Tags

Parameters
Mfr Microchip Technology
Series SmartFusion®
Package Tray
Product Status Active
Architecture MCU, FPGA
Core Processor ARM® Cortex®-M3
Flash Size 256KB
RAM Size 64KB
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I²C, SPI, UART/USART
Speed 80MHz
Primary Attributes ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 256-LBGA
Supplier Device Package 256-FPBGA (17x17)
Number of I/O MCU - 25, FPGA - 66
Base Product Number A2F200
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Standard Package 90
ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion® ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops 80MHz 256-FPBGA (17x17)
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