Parameters |
RAM Size |
64KB |
Peripherals |
DDR, PCIe, SERDES |
Connectivity |
CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed |
166MHz |
Primary Attributes |
FPGA - 50K Logic Modules |
Operating Temperature |
-40°C ~ 100°C (TJ) |
Package / Case |
896-BGA |
Supplier Device Package |
896-FBGA (31x31) |
Number of I/O |
377 |
Base Product Number |
M2S050 |
RoHS Status |
RoHS non-compliant |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
REACH Status |
REACH Unaffected |
ECCN |
3A991D |
HTSUS |
8542.39.0001 |
Standard Package |
27 |
Mfr |
Microchip Technology |
Series |
SmartFusion®2 |
Package |
Tray |
Product Status |
Active |
Architecture |
MCU, FPGA |
Core Processor |
ARM® Cortex®-M3 |
Flash Size |
256KB |
ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion®2 FPGA - 50K Logic Modules 166MHz 896-FBGA (31x31)