Microchip Technology M2S060-FGG676

M2S060-FGG676


  • Manufacturer: Microchip Technology
  • CONEVO NO: M2S060-FGG676
  • Package: 676-BGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: M2S060-FGG676(Kg)

Details

Tags

Parameters
Mfr Microchip Technology
Series SmartFusion®2
Package Tray
Product Status Active
Architecture MCU, FPGA
Core Processor ARM® Cortex®-M3
Flash Size 256KB
RAM Size 64KB
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed 166MHz
Primary Attributes FPGA - 60K Logic Modules
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 676-BGA
Supplier Device Package 676-FBGA (27x27)
Number of I/O 387
Base Product Number M2S060
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Standard Package 40
ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion®2 FPGA - 60K Logic Modules 166MHz 676-FBGA (27x27)
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