Microchip Technology M2S060TS-1FGG676T2

M2S060TS-1FGG676T2


  • Manufacturer: Microchip Technology
  • CONEVO NO: M2S060TS-1FGG676T2
  • Package: 676-BGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: M2S060TS-1FGG676T2(Kg)

Details

Tags

Parameters
Mfr Microchip Technology
Series Automotive, AEC-Q100, SmartFusion®2
Package Tray
Product Status Active
Architecture MCU, FPGA
Core Processor ARM® Cortex®-M3
Flash Size 256KB
RAM Size 64KB
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed 166MHz
Primary Attributes FPGA - 60K Logic Modules
Operating Temperature -40°C ~ 125°C (TJ)
Package / Case 676-BGA
Supplier Device Package 676-FBGA (27x27)
Number of I/O 387
Base Product Number M2S060
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
HTSUS 0000.00.0000
Standard Package 40
ARM® Cortex®-M3 System On Chip (SOC) IC Automotive, AEC-Q100, SmartFusion®2 FPGA - 60K Logic Modules 166MHz 676-FBGA (27x27)
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