Parameters |
Mfr |
Microchip Technology |
Series |
Automotive, AEC-Q100, SmartFusion®2 |
Package |
Tray |
Product Status |
Active |
Architecture |
MCU, FPGA |
Core Processor |
ARM® Cortex®-M3 |
Flash Size |
512KB |
RAM Size |
64KB |
Peripherals |
DDR, PCIe, SERDES |
Connectivity |
CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed |
166MHz |
Primary Attributes |
FPGA - 90K Logic Modules |
Operating Temperature |
-40°C ~ 125°C (TJ) |
Package / Case |
676-BGA |
Supplier Device Package |
676-FBGA (27x27) |
Number of I/O |
425 |
Base Product Number |
M2S090 |
RoHS Status |
ROHS3 Compliant |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
REACH Status |
REACH Unaffected |
HTSUS |
0000.00.0000 |
Standard Package |
40 |
ARM® Cortex®-M3 System On Chip (SOC) IC Automotive, AEC-Q100, SmartFusion®2 FPGA - 90K Logic Modules 166MHz 676-FBGA (27x27)