Microchip Technology TSXPC860SRVZQU66D

TSXPC860SRVZQU66D


  • Manufacturer: Microchip Technology
  • CONEVO NO: TSXPC860SRVZQU66D
  • Package: 357-BBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: TSXPC860SRVZQU66D(Kg)

Details

Tags

Parameters
Mfr Microchip Technology
Series -
Package Tray
Product Status Obsolete
Core Processor PowerPC
Number of Cores/Bus Width 1 Core, 32-Bit
Speed 66MHz
Co-Processors/DSP Communications; CPM
RAM Controllers DRAM
Graphics Acceleration No
Display & Interface Controllers -
Ethernet 10/100Mbps (1)
SATA -
USB -
Voltage - I/O 3.3V
Operating Temperature -40°C ~ 110°C (TC)
Security Features -
Mounting Type Surface Mount
Package / Case 357-BBGA
Supplier Device Package 357-PBGA (25x25)
Additional Interfaces I²C, PCMCIA, SCC, SMC, SPI, UART
Base Product Number TSXPC860
RoHS Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A001A3
HTSUS 8542.31.0001
Standard Package 44
PowerPC Microprocessor IC - 1 Core, 32-Bit 66MHz 357-PBGA (25x25)
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