Micron Technology Inc. MT61K512M32KPA-16:C

MT61K512M32KPA-16:C


  • Manufacturer: Micron Technology Inc.
  • CONEVO NO: MT61K512M32KPA-16:C
  • Package: 180-TFBGA
  • Datasheet: -
  • Stock: In stock
  • Description: MT61K512M32KPA-16:C(Kg)

Details

Tags

Parameters
Mfr Micron Technology Inc.
Series -
Package Box
Product Status Active
Memory Type Volatile
Memory Format DRAM
Technology SGRAM - GDDR6
Memory Size 16Gbit
Memory Organization 512M x 32
Memory Interface POD_135
Clock Frequency 8 GHz
Write Cycle Time - Word, Page -
Voltage - Supply 1.3095V ~ 1.3905V
Operating Temperature 0°C ~ 95°C (TC)
Mounting Type Surface Mount
Package / Case 180-TFBGA
Supplier Device Package 180-FBGA (12x14)
Other Names 557-MT61K512M32KPA-16:C
Standard Package 1
SGRAM - GDDR6 Memory IC 16Gbit POD_135 8 GHz 180-FBGA (12x14)
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