Parameters |
Mfr |
Microsemi Corporation |
Series |
SmartFusion® |
Package |
Tray |
Product Status |
Obsolete |
Architecture |
MCU, FPGA |
Core Processor |
ARM® Cortex®-M3 |
Flash Size |
128KB |
RAM Size |
16KB |
Peripherals |
DMA, POR, WDT |
Connectivity |
EBI/EMI, I²C, SPI, UART/USART |
Speed |
100MHz |
Primary Attributes |
ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops |
Operating Temperature |
-40°C ~ 100°C (TJ) |
Package / Case |
288-TFBGA, CSPBGA |
Supplier Device Package |
288-CSP (11x11) |
Number of I/O |
MCU - 28, FPGA - 68 |
Base Product Number |
A2F060M3E |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
REACH Status |
REACH Unaffected |
ECCN |
3A991D |
HTSUS |
8542.39.0001 |
Standard Package |
176 |
ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion® ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops 100MHz 288-CSP (11x11)