Microsemi Corporation A2F060M3E-1FGG256I

A2F060M3E-1FGG256I


  • Manufacturer: Microsemi Corporation
  • CONEVO NO: A2F060M3E-1FGG256I
  • Package: 256-LBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: A2F060M3E-1FGG256I(Kg)

Details

Tags

Parameters
Mfr Microsemi Corporation
Series SmartFusion®
Package Tray
Product Status Obsolete
Architecture MCU, FPGA
Core Processor ARM® Cortex®-M3
Flash Size 128KB
RAM Size 16KB
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, I²C, SPI, UART/USART
Speed 100MHz
Primary Attributes ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 256-LBGA
Supplier Device Package 256-FPBGA (17x17)
Number of I/O MCU - 26, FPGA - 66
Base Product Number A2F060M3E
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Standard Package 90
ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion® ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops 100MHz 256-FPBGA (17x17)
Contact Information
close