Microsemi Corporation A2F060M3E-FGG256M
If you need to check our product or price list, please leave your email and we will contact you within 24 hours. Clicking on the website skype will result in a faster response!
Email:info@conevoelec.com
| Parameters | |
|---|---|
| Mfr | Microsemi Corporation |
| Series | SmartFusion® |
| Package | Tray |
| Product Status | Obsolete |
| Architecture | MCU, FPGA |
| Core Processor | ARM® Cortex®-M3 |
| Flash Size | 128KB |
| RAM Size | 16KB |
| Peripherals | DMA, POR, WDT |
| Connectivity | EBI/EMI, I²C, SPI, UART/USART |
| Speed | 80MHz |
| Primary Attributes | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops |
| Operating Temperature | -55°C ~ 125°C (TJ) |
| Package / Case | 256-LBGA |
| Supplier Device Package | 256-FPBGA (17x17) |
| Number of I/O | MCU - 26, FPGA - 66 |
| Base Product Number | A2F060M3E |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| REACH Status | REACH Unaffected |
| ECCN | 3A001A2C |
| HTSUS | 8542.39.0001 |
| Standard Package | 90 |
ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion® ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops 80MHz 256-FPBGA (17x17)
