Microsemi Corporation M1AFS250-1QNG180I

M1AFS250-1QNG180I


  • Manufacturer: Microsemi Corporation
  • CONEVO NO: M1AFS250-1QNG180I
  • Package: 180-WFQFN Dual Rows, Exposed Pad
  • Datasheet: PDF
  • Stock: In stock
  • Description: M1AFS250-1QNG180I(Kg)

Details

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Parameters
Mfr Microsemi Corporation
Series Fusion®
Package Tray
Product Status Obsolete
Conevo-Key Programmable Not Verified
Total RAM Bits 36864
Number of I/O 65
Number of Gates 250000
Voltage - Supply 1.425V ~ 1.575V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 180-WFQFN Dual Rows, Exposed Pad
Supplier Device Package 180-QFN (10x10)
Base Product Number M1AFS250
Moisture Sensitivity Level (MSL) 3 (168 Hours)
ECCN 3A991D
HTSUS 8542.39.0001
Standard Package 184
Fusion® Field Programmable Gate Array (FPGA) IC 65 36864 180-WFQFN Dual Rows, Exposed Pad
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