Microsemi Corporation M2S050S-1FGG896I

M2S050S-1FGG896I


  • Manufacturer: Microsemi Corporation
  • CONEVO NO: M2S050S-1FGG896I
  • Package: 896-BGA
  • Datasheet: PDF
  • Stock: In stock
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Parameters
Mfr Microsemi Corporation
Series SmartFusion®2
Package Tray
Product Status Obsolete
Architecture MCU, FPGA
Core Processor ARM® Cortex®-M3
Flash Size 256KB
RAM Size 64KB
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed 166MHz
Primary Attributes FPGA - 50K Logic Modules
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 896-BGA
Supplier Device Package 896-FBGA (31x31)
Number of I/O 377
Base Product Number M2S050S
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 5A002A1
HTSUS 8542.39.0001
Standard Package 27
ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion®2 FPGA - 50K Logic Modules 166MHz 896-FBGA (31x31)
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