Microsemi Corporation M2S090-1FG676IX417

M2S090-1FG676IX417


  • Manufacturer: Microsemi Corporation
  • CONEVO NO: M2S090-1FG676IX417
  • Package: 676-BGA
  • Datasheet: PDF
  • Stock: In stock
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Parameters
Mfr Microsemi Corporation
Series SmartFusion®2
Package Bag
Product Status Obsolete
Architecture MCU, FPGA
Core Processor ARM® Cortex®-M3
Flash Size 512KB
RAM Size 64KB
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed 166MHz
Primary Attributes FPGA - 90K Logic Modules
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 676-BGA
Supplier Device Package 676-FBGA (27x27)
Number of I/O 425
RoHS Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Standard Package 1
ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion®2 FPGA - 90K Logic Modules 166MHz 676-FBGA (27x27)
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