Nisshinbo Micro Devices Inc. RP605Z183B-E2-F

RP605Z183B-E2-F


  • Manufacturer: Nisshinbo Micro Devices Inc.
  • CONEVO NO: RP605Z183B-E2-F
  • Package: 20-XFBGA, WLCSP
  • Datasheet: PDF
  • Stock: In stock
  • Description: RP605Z183B-E2-F(Kg)

Details

Tags

Parameters
Mfr Nisshinbo Micro Devices Inc.
Series RP605x
Package Tape & Reel (TR)
Product Status Active
Applications Battery Management, Power Supplies
Current - Supply 300nA
Voltage - Supply 1.8V ~ 5.5V
Operating Temperature -40°C ~ 85°C
Mounting Type Surface Mount
Package / Case 20-XFBGA, WLCSP
Supplier Device Package 20-WLCSP-P3 (2.32x1.71)
Base Product Number RP605
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN EAR99
HTSUS 8542.39.0001
Standard Package 5,000
Battery Management, Power Supplies PMIC 20-WLCSP-P3 (2.32x1.71)
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