NXP Semiconductors MC33790HEGR2

MC33790HEGR2


  • Manufacturer: NXP Semiconductors
  • CONEVO NO: MC33790HEGR2
  • Package: 16-SOIC (0.295", 7.50mm Width)
  • Datasheet: -
  • Stock: In stock
  • Description: MC33790HEGR2(Kg)

Details

Tags

Parameters
Mfr NXP Semiconductors
Series -
Package Bulk
Product Status Obsolete
Conevo-Key Programmable Not Verified
Type Distributed System Interface (DSI)
Applications -
Mounting Type Surface Mount
Package / Case 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package 16-SOIC
RoHS Status RoHS non-compliant
REACH Status Vendor Undefined
ECCN EAR99
HTSUS 8542.39.0001
Other Names 2156-MC33790HEGR2
Standard Package 1
Distributed System Interface (DSI) 16-SOIC
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