NXP Semiconductors NX3L2G384GM,125

NX3L2G384GM,125


  • Manufacturer: NXP Semiconductors
  • CONEVO NO: NX3L2G384GM,125
  • Package: 8-XFQFN Exposed Pad
  • Datasheet: -
  • Stock: In stock
  • Description: NX3L2G384GM,125(Kg)

Details

Tags

Parameters
HTSUS 8542.39.0001
Other Names 2156-NX3L2G384GM,125
Standard Package 1
Mfr NXP Semiconductors
Series -
Package Bulk
Product Status Obsolete
Switch Circuit SPST - NO
Multiplexer/Demultiplexer Circuit 1:1
Number of Circuits 2
On-State Resistance (Max) 900mOhm
Channel-to-Channel Matching (ΔRon) 20mOhm
Voltage - Supply, Single (V+) 1.4V ~ 4.3V
Voltage - Supply, Dual (V±) -
Switch Time (Ton, Toff) (Max) 24ns, 7ns
-3db Bandwidth 60MHz
Charge Injection 6pC
Channel Capacitance (CS(off), CD(off)) 35pF
Current - Leakage (IS(off)) (Max) 10nA
Crosstalk -90dB @ 100kHz
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Package / Case 8-XFQFN Exposed Pad
Supplier Device Package 8-XQFN (1.6x1.6)
RoHS Status RoHS non-compliant
REACH Status Vendor Undefined
ECCN EAR99
2 Circuit IC Switch 1:1 900mOhm 8-XQFN (1.6x1.6)
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