NXP USA Inc. BSC9131NSN1KHKB557

BSC9131NSN1KHKB557


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: BSC9131NSN1KHKB557
  • Package: 520-FBGA, FCBGA
  • Datasheet: -
  • Stock: In stock
  • Description: BSC9131NSN1KHKB557(Kg)

Details

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Parameters
Mfr NXP USA Inc.
Series QorIQ Qonverge BSC
Package Bulk
Product Status Active
Core Processor PowerPC e500
Number of Cores/Bus Width 1 Core, 32-Bit
Speed 800MHz
Co-Processors/DSP Signal Processing; SC3850
RAM Controllers DDR3, DDR3L
Graphics Acceleration No
Display & Interface Controllers -
Ethernet 10/100/1000Mbps (2)
SATA -
USB USB 2.0 (1)
Voltage - I/O 1.8V, 2.5V, 3.3V
Operating Temperature 0°C ~ 105°C (TA)
Security Features -
Mounting Type Surface Mount
Package / Case 520-FBGA, FCBGA
Supplier Device Package 520-FCBGA (21x21)
Additional Interfaces AIC, DUART, I²C, MMC/SD, SPI, USIM
RoHS Status Not applicable
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status Vendor Undefined
ECCN 3A991A2
HTSUS 8542.31.0001
Standard Package 1
PowerPC e500 Microprocessor IC QorIQ Qonverge BSC 1 Core, 32-Bit 800MHz 520-FCBGA (21x21)
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