NXP USA Inc. DSPB56367AG150

DSPB56367AG150


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: DSPB56367AG150
  • Package: 144-LQFP
  • Datasheet: PDF
  • Stock: In stock
  • Description: DSPB56367AG150(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series DSP56K/Symphony
Package Tray
Product Status Not For New Designs
Type Audio Processor
Interface Host Interface, I²C, SAI, SPI
Clock Rate 150MHz
Non-Volatile Memory ROM (240kB)
On-Chip RAM 69kB
Voltage - I/O 3.30V
Voltage - Core 1.80V
Operating Temperature 0°C ~ 70°C (TA)
Mounting Type Surface Mount
Package / Case 144-LQFP
Supplier Device Package 144-LQFP (20x20)
Base Product Number DSPB56367
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Other Names 935325141557
Standard Package 300
Contact Information
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