NXP USA Inc. LPC1112FHI33/203,5

LPC1112FHI33/203,5


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: LPC1112FHI33/203,5
  • Package: 32-VFQFN Exposed Pad
  • Datasheet: PDF
  • Stock: In stock
  • Description: LPC1112FHI33/203,5(Kg)

Details

Tags

Parameters
EEPROM Size -
RAM Size 4K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V
Data Converters A/D 8x10b
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 32-VFQFN Exposed Pad
Supplier Device Package 32-HVQFN (5x5)
Base Product Number LPC1112
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Standard Package 490
Mfr NXP USA Inc.
Series LPC1100XL
Package Tray
Product Status Active
Core Processor ARM® Cortex®-M0
Core Size 32-Bit Single-Core
Speed 50MHz
Connectivity I²C, SPI, UART/USART
Peripherals Brown-out Detect/Reset, POR, WDT
Number of I/O 28
Program Memory Size 16KB (16K x 8)
Program Memory Type FLASH
ARM® Cortex®-M0 LPC1100XL Microcontroller IC 32-Bit Single-Core 50MHz 16KB (16K x 8) FLASH 32-HVQFN (5x5)
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