NXP USA Inc. LPC1112FHI33/203,5
| Parameters | |
|---|---|
| EEPROM Size | - |
| RAM Size | 4K x 8 |
| Voltage - Supply (Vcc/Vdd) | 1.8V ~ 3.6V |
| Data Converters | A/D 8x10b |
| Oscillator Type | Internal |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 32-VFQFN Exposed Pad |
| Supplier Device Package | 32-HVQFN (5x5) |
| Base Product Number | LPC1112 |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| REACH Status | REACH Unaffected |
| ECCN | 3A991A2 |
| HTSUS | 8542.31.0001 |
| Standard Package | 490 |
| Mfr | NXP USA Inc. |
| Series | LPC1100XL |
| Package | Tray |
| Product Status | Active |
| Core Processor | ARM® Cortex®-M0 |
| Core Size | 32-Bit Single-Core |
| Speed | 50MHz |
| Connectivity | I²C, SPI, UART/USART |
| Peripherals | Brown-out Detect/Reset, POR, WDT |
| Number of I/O | 28 |
| Program Memory Size | 16KB (16K x 8) |
| Program Memory Type | FLASH |
ARM® Cortex®-M0 LPC1100XL Microcontroller IC 32-Bit Single-Core 50MHz 16KB (16K x 8) FLASH 32-HVQFN (5x5)
