NXP USA Inc. LPC11D14FBD100/302

LPC11D14FBD100/302


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: LPC11D14FBD100/302
  • Package: 100-LQFP
  • Datasheet: PDF
  • Stock: In stock
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Parameters
Mfr NXP USA Inc.
Series LPC11Dxx
Package Tray
Product Status Active
Core Processor ARM® Cortex®-M0
Core Size 32-Bit Single-Core
Speed 50MHz
Connectivity I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals Brown-out Detect/Reset, LCD, POR, WDT
Number of I/O 42
Program Memory Size 32KB (32K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 8K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V
Data Converters A/D 8x10b
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 100-LQFP
Supplier Device Package 100-LQFP (14x14)
Base Product Number LPC11
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Standard Package 90
ARM® Cortex®-M0 LPC11Dxx Microcontroller IC 32-Bit Single-Core 50MHz 32KB (32K x 8) FLASH 100-LQFP (14x14)
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