NXP USA Inc. LPC1311FHN33/01,55

LPC1311FHN33/01,55


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: LPC1311FHN33/01,55
  • Package: 32-VQFN Exposed Pad
  • Datasheet: PDF
  • Stock: In stock
If you need to check our product or price list, please leave your email and we will contact you within 24 hours. Clicking on the website skype will result in a faster response!

Details

Tags

Parameters
Mfr NXP USA Inc.
Series LPC13xx
Package Tray
Product Status Active
Core Processor ARM® Cortex®-M3
Core Size 32-Bit Single-Core
Speed 72MHz
Connectivity I²C, Microwire, SPI, SSI, UART/USART
Peripherals Brown-out Detect/Reset, POR, WDT
Number of I/O 28
Program Memory Size 8KB (8K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 4K x 8
Voltage - Supply (Vcc/Vdd) 2V ~ 3.6V
Data Converters A/D 8x10b
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 32-VQFN Exposed Pad
Supplier Device Package 32-HVQFN (7x7)
Base Product Number LPC1311
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Standard Package 260
ARM® Cortex®-M3 LPC13xx Microcontroller IC 32-Bit Single-Core 72MHz 8KB (8K x 8) FLASH 32-HVQFN (7x7)
Contact Information
close