NXP USA Inc. LPC1766FBD100,551

LPC1766FBD100,551


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: LPC1766FBD100,551
  • Package: 100-LQFP
  • Datasheet: -
  • Stock: In stock
  • Description: LPC1766FBD100,551(Kg)

Details

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Parameters
Mfr NXP USA Inc.
Series LPC17xx
Package Tray
Product Status Discontinued at Digi-Key
Core Processor ARM® Cortex®-M3
Core Size 32-Bit Single-Core
Speed 100MHz
Connectivity CANbus, Ethernet, I²C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Number of I/O 70
Program Memory Size 256KB (256K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 64K x 8
Voltage - Supply (Vcc/Vdd) 2.4V ~ 3.6V
Data Converters A/D 8x12b; D/A 1x10b
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 100-LQFP
Supplier Device Package 100-LQFP (14x14)
Base Product Number LPC1766
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Standard Package 90
ARM® Cortex®-M3 LPC17xx Microcontroller IC 32-Bit Single-Core 100MHz 256KB (256K x 8) FLASH 100-LQFP (14x14)
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