NXP USA Inc. LPC1810FBD144,551

LPC1810FBD144,551


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: LPC1810FBD144,551
  • Package: 144-LQFP
  • Datasheet: PDF
  • Stock: In stock
  • Description: LPC1810FBD144,551(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series LPC18xx
Package Tray
Product Status Active
Core Processor ARM® Cortex®-M3
Core Size 32-Bit Single-Core
Speed 180MHz
Connectivity CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number of I/O 83
Program Memory Size -
Program Memory Type ROMless
EEPROM Size -
RAM Size 136K x 8
Voltage - Supply (Vcc/Vdd) 2.2V ~ 3.6V
Data Converters A/D 8x10b; D/A 1x10b
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 144-LQFP
Supplier Device Package 144-LQFP (20x20)
Base Product Number LPC1810
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Standard Package 60
ARM® Cortex®-M3 LPC18xx Microcontroller IC 32-Bit Single-Core 180MHz ROMless 144-LQFP (20x20)
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