NXP USA Inc. LPC1833JET100E

LPC1833JET100E


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: LPC1833JET100E
  • Package: 100-TFBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: LPC1833JET100E(Kg)

Details

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Parameters
Mfr NXP USA Inc.
Series LPC18xx
Package Tray
Product Status Active
Core Processor ARM® Cortex®-M3
Core Size 32-Bit Single-Core
Speed 180MHz
Connectivity CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals Brown-out Detect/Reset, DMA, I²S, POR, WDT
Number of I/O 49
Program Memory Size 512KB (512K x 8)
Program Memory Type FLASH
EEPROM Size 16K x 8
RAM Size 136K x 8
Voltage - Supply (Vcc/Vdd) 2.2V ~ 3.6V
Data Converters A/D 4x10b; D/A 1x10b
Oscillator Type Internal
Operating Temperature -40°C ~ 105°C (TA)
Mounting Type Surface Mount
Package / Case 100-TFBGA
Supplier Device Package 100-TFBGA (9x9)
Base Product Number LPC1833
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Standard Package 260
ARM® Cortex®-M3 LPC18xx Microcontroller IC 32-Bit Single-Core 180MHz 512KB (512K x 8) FLASH 100-TFBGA (9x9)
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