NXP USA Inc. LPC18S30FET100E

LPC18S30FET100E


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: LPC18S30FET100E
  • Package: 100-TFBGA
  • Datasheet: -
  • Stock: In stock
  • Description: LPC18S30FET100E(Kg)

Details

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Parameters
Mfr NXP USA Inc.
Series LPC18xx
Package Tray
Product Status Active
Core Processor ARM® Cortex®-M3
Core Size 32-Bit Single-Core
Speed 180MHz
Connectivity CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Peripherals Brown-out Detect/Reset, DMA, I²S, POR, WDT
Number of I/O 49
Program Memory Size -
Program Memory Type ROMless
EEPROM Size -
RAM Size 200K x 8
Voltage - Supply (Vcc/Vdd) 2.2V ~ 3.6V
Data Converters A/D 4x10b; D/A 1x10b
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 100-TFBGA
Supplier Device Package 100-TFBGA (9x9)
Base Product Number LPC18S30
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 5A992C
HTSUS 8542.31.0001
Other Names 935305907551
Standard Package 260
ARM® Cortex®-M3 LPC18xx Microcontroller IC 32-Bit Single-Core 180MHz ROMless 100-TFBGA (9x9)
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