NXP USA Inc. LPC18S30FET256E

LPC18S30FET256E


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: LPC18S30FET256E
  • Package: 256-LBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: LPC18S30FET256E(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series LPC18xx
Package Tray
Product Status Active
Core Processor ARM® Cortex®-M3
Core Size 32-Bit Single-Core
Speed 180MHz
Connectivity CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Peripherals Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number of I/O 164
Program Memory Size -
Program Memory Type ROMless
EEPROM Size -
RAM Size 200K x 8
Voltage - Supply (Vcc/Vdd) 2.2V ~ 3.6V
Data Converters A/D 8x10b; D/A 1x10b
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 256-LBGA
Supplier Device Package 256-LBGA (17x17)
Base Product Number LPC18S30
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 5A992C
HTSUS 8542.31.0001
Standard Package 90
ARM® Cortex®-M3 LPC18xx Microcontroller IC 32-Bit Single-Core 180MHz ROMless 256-LBGA (17x17)
Contact Information
close