NXP USA Inc. LPC2220FBD144,551

LPC2220FBD144,551


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: LPC2220FBD144,551
  • Package: 144-LQFP
  • Datasheet: PDF
  • Stock: In stock
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Parameters
Mfr NXP USA Inc.
Series LPC2200
Package Tray
Product Status Not For New Designs
Core Processor ARM7®
Core Size 16/32-Bit
Speed 75MHz
Connectivity EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals POR, PWM, WDT
Number of I/O 76
Program Memory Size -
Program Memory Type ROMless
EEPROM Size -
RAM Size 64K x 8
Voltage - Supply (Vcc/Vdd) 1.65V ~ 3.6V
Data Converters A/D 8x10b
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 144-LQFP
Supplier Device Package 144-LQFP (20x20)
Base Product Number LPC2220
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 2 (1 Year)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Standard Package 60
ARM7® LPC2200 Microcontroller IC 16/32-Bit 75MHz ROMless 144-LQFP (20x20)
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