NXP USA Inc. LPC2290FBD144/01,5
| Parameters | |
|---|---|
| Mfr | NXP USA Inc. |
| Series | LPC2200 |
| Package | Tray |
| Product Status | Not For New Designs |
| Core Processor | ARM7® |
| Core Size | 16/32-Bit |
| Speed | 60MHz |
| Connectivity | CANbus, EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART |
| Peripherals | PWM, WDT |
| Number of I/O | 76 |
| Program Memory Size | - |
| Program Memory Type | ROMless |
| EEPROM Size | - |
| RAM Size | 64K x 8 |
| Voltage - Supply (Vcc/Vdd) | 1.65V ~ 3.6V |
| Data Converters | A/D 8x10b |
| Oscillator Type | Internal |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 144-LQFP |
| Supplier Device Package | 144-LQFP (20x20) |
| Base Product Number | LPC2290 |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 2 (1 Year) |
| REACH Status | REACH Unaffected |
| ECCN | 3A991A2 |
| HTSUS | 8542.31.0001 |
| Standard Package | 60 |
ARM7® LPC2200 Microcontroller IC 16/32-Bit 60MHz ROMless 144-LQFP (20x20)
