NXP USA Inc. LPC2917FBD144/01551

LPC2917FBD144/01551


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: LPC2917FBD144/01551
  • Package: 144-LQFP
  • Datasheet: PDF
  • Stock: In stock
  • Description: LPC2917FBD144/01551(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series LPC2900
Package Bulk
Product Status Active
Core Processor ARM9®
Core Size 16/32-Bit
Speed 80MHz
Connectivity CANbus, EBI/EMI, LINbus, SPI, UART/USART
Peripherals POR, PWM, WDT
Number of I/O 108
Program Memory Size 512KB (512K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 80K x 8
Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V
Data Converters A/D 16x10b
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 144-LQFP
Supplier Device Package 144-LQFP (20x20)
Base Product Number LPC2917
RoHS Status Not applicable
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status Vendor Undefined
ECCN 3A991A2
HTSUS 8542.31.0001
Standard Package 1
ARM9® LPC2900 Microcontroller IC 16/32-Bit 80MHz 512KB (512K x 8) FLASH 144-LQFP (20x20)
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