NXP USA Inc. LPC2925FBD100,551

LPC2925FBD100,551


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: LPC2925FBD100,551
  • Package: 100-LQFP
  • Datasheet: PDF
  • Stock: In stock
  • Description: LPC2925FBD100,551(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series LPC2900
Package Tray
Product Status Not For New Designs
Core Processor ARM9®
Core Size 16/32-Bit
Speed 125MHz
Connectivity CANbus, I²C, LINbus, SPI, UART/USART, USB
Peripherals DMA, POR, PWM, WDT
Number of I/O 60
Program Memory Size 512KB (512K x 8)
Program Memory Type FLASH
EEPROM Size 16K x 8
RAM Size 40K x 8
Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V
Data Converters A/D 16x8b
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 100-LQFP
Supplier Device Package 100-LQFP (14x14)
Base Product Number LPC2925
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Standard Package 90
ARM9® LPC2900 Microcontroller IC 16/32-Bit 125MHz 512KB (512K x 8) FLASH 100-LQFP (14x14)
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