NXP USA Inc. LPC55S66JBD64K

LPC55S66JBD64K


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: LPC55S66JBD64K
  • Package: 64-TQFP Exposed Pad
  • Datasheet: PDF
  • Stock: In stock
  • Description: LPC55S66JBD64K(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series LPC55S6x
Package Tray
Product Status Active
Core Processor ARM® Cortex®-M33
Core Size 32-Bit Single-Core
Speed 150MHz
Connectivity Flexcomm, I²C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number of I/O 36
Program Memory Size 256KB (256K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 144K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V
Data Converters A/D 10x16b
Oscillator Type Internal
Operating Temperature -40°C ~ 105°C (TA)
Mounting Type Surface Mount
Package / Case 64-TQFP Exposed Pad
Supplier Device Package 64-HTQFP (10x10)
Base Product Number LPC55S66
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
HTSUS 8542.31.0001
Standard Package 800
ARM® Cortex®-M33 LPC55S6x Microcontroller IC 32-Bit Single-Core 150MHz 256KB (256K x 8) FLASH 64-HTQFP (10x10)
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