NXP USA Inc. LPC55S66JBD64K
| Parameters | |
|---|---|
| Mfr | NXP USA Inc. |
| Series | LPC55S6x |
| Package | Tray |
| Product Status | Active |
| Core Processor | ARM® Cortex®-M33 |
| Core Size | 32-Bit Single-Core |
| Speed | 150MHz |
| Connectivity | Flexcomm, I²C, MMC/SD/SDIO, SPI, UART/USART, USB |
| Peripherals | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT |
| Number of I/O | 36 |
| Program Memory Size | 256KB (256K x 8) |
| Program Memory Type | FLASH |
| EEPROM Size | - |
| RAM Size | 144K x 8 |
| Voltage - Supply (Vcc/Vdd) | 1.8V ~ 3.6V |
| Data Converters | A/D 10x16b |
| Oscillator Type | Internal |
| Operating Temperature | -40°C ~ 105°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 64-TQFP Exposed Pad |
| Supplier Device Package | 64-HTQFP (10x10) |
| Base Product Number | LPC55S66 |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| REACH Status | REACH Unaffected |
| HTSUS | 8542.31.0001 |
| Standard Package | 800 |
ARM® Cortex®-M33 LPC55S6x Microcontroller IC 32-Bit Single-Core 150MHz 256KB (256K x 8) FLASH 64-HTQFP (10x10)
