NXP USA Inc. LS1022AXE7EKB

LS1022AXE7EKB


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: LS1022AXE7EKB
  • Package: 525-FBGA, FCBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: LS1022AXE7EKB(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series QorIQ® Layerscape
Package Tray
Product Status Active
Core Processor ARM® Cortex®-A7
Number of Cores/Bus Width 2 Core, 32-Bit
Speed 600MHz
Co-Processors/DSP Multimedia; NEON™ SIMD
RAM Controllers DDR3L, DDR4
Graphics Acceleration -
Display & Interface Controllers -
Ethernet GbE (2)
SATA SATA 3Gbps (1)
USB USB 2.0 (1)
Voltage - I/O -
Operating Temperature -40°C ~ 105°C
Security Features Secure Boot, TrustZone®
Mounting Type Surface Mount
Package / Case 525-FBGA, FCBGA
Supplier Device Package 525-FCPBGA (19x19)
Additional Interfaces -
Base Product Number LS1022
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
HTSUS 0000.00.0000
Other Names 935316086557
Standard Package 84
ARM® Cortex®-A7 Microprocessor IC QorIQ® Layerscape 2 Core, 32-Bit 600MHz 525-FCPBGA (19x19)
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