NXP USA Inc. LX2162RE82029B

LX2162RE82029B


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: LX2162RE82029B
  • Package: 1150-FBGA
  • Datasheet: -
  • Stock: In stock
  • Description: LX2162RE82029B(Kg)

Details

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Parameters
Mfr NXP USA Inc.
Series QorIQ LX
Package Tray
Product Status Active
Core Processor ARM® Cortex®-A72
Number of Cores/Bus Width 16 Core, 64-Bit
Speed 2GHz
Co-Processors/DSP -
RAM Controllers DDR4, SDRAM
Graphics Acceleration No
Display & Interface Controllers -
Ethernet -
SATA SATA 6Gbps (4)
USB USB 3.0 (1)
Voltage - I/O -
Operating Temperature 5°C ~ 105°C (TA)
Security Features -
Mounting Type Surface Mount
Package / Case 1150-FBGA
Supplier Device Package 1150-FBGA (23x23)
Additional Interfaces CANbus, I²C, PCIe, SPI, UART
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
Standard Package 60
ARM® Cortex®-A72 Microprocessor IC QorIQ LX 16 Core, 64-Bit 2GHz 1150-FBGA (23x23)
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