NXP USA Inc. M82108G13

M82108G13


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: M82108G13
  • Package: 672-BGA
  • Datasheet: -
  • Stock: In stock
  • Description: M82108G13(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series *
Package Bulk
Product Status Obsolete
Mounting Type Surface Mount
Package / Case 672-BGA
Supplier Device Package 672-TEPBGA (27x27)
Base Product Number M8210
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 5A002A1
HTSUS 8542.31.0001
Standard Package 1
Telecom IC 672-TEPBGA (27x27)
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