NXP USA Inc. MC16Z3BCAG16
| Parameters | |
|---|---|
| Mfr | NXP USA Inc. |
| Series | HC16 |
| Package | Tray |
| Product Status | Obsolete |
| Core Processor | CPU16 |
| Core Size | 16-Bit |
| Speed | 16MHz |
| Connectivity | EBI/EMI, SCI, SPI |
| Peripherals | POR, PWM, WDT |
| Number of I/O | 16 |
| Program Memory Size | 8KB (8K x 8) |
| Program Memory Type | Mask ROM |
| EEPROM Size | - |
| RAM Size | 4K x 8 |
| Voltage - Supply (Vcc/Vdd) | 2.7V ~ 5.5V |
| Data Converters | A/D 8x10b |
| Oscillator Type | External |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 144-LQFP |
| Supplier Device Package | 144-LQFP (20x20) |
| Base Product Number | MC16Z |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| REACH Status | REACH Unaffected |
| ECCN | EAR99 |
| HTSUS | 8542.31.0001 |
| Standard Package | 60 |
CPU16 HC16 Microcontroller IC 16-Bit 16MHz 8KB (8K x 8) Mask ROM 144-LQFP (20x20)
