NXP USA Inc. MC33790HEGR2

MC33790HEGR2


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MC33790HEGR2
  • Package: 16-SOIC (0.295", 7.50mm Width)
  • Datasheet: -
  • Stock: In stock
  • Description: MC33790HEGR2(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series -
Package Tape & Reel (TR)
Product Status Obsolete
Conevo-Key Programmable Not Verified
Type Distributed Systems Interface
Input Type Logic
Output Type Logic
Current - Supply 1 mA
Operating Temperature -40°C ~ 85°C
Mounting Type Surface Mount
Package / Case 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package 16-SOIC
Base Product Number MC337
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001
Other Names 935314499518
Standard Package 1,000
Contact Information
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