NXP USA Inc. MC33793DR2

MC33793DR2


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MC33793DR2
  • Package: 16-SOIC (0.154", 3.90mm Width)
  • Datasheet: PDF
  • Stock: In stock
  • Description: MC33793DR2(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series -
Package Tape & Reel (TR)
Product Status Obsolete
Type Distributed Systems Interface
Input Type Logic
Output Type Logic
Operating Temperature -40°C ~ 150°C
Mounting Type Surface Mount
Package / Case 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package 16-SOIC
Base Product Number MC337
RoHS Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.31.0001
Standard Package 2,500
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