NXP USA Inc. MC33794DWB

MC33794DWB


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MC33794DWB
  • Package: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
  • Datasheet: PDF
  • Stock: In stock
  • Description: MC33794DWB(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series -
Package Tube
Product Status Obsolete
Conevo-Key Programmable Not Verified
Type Sensor Interface
Input Type Logic
Output Type Logic
Current - Supply 7 mA
Operating Temperature -40°C ~ 85°C
Mounting Type Surface Mount
Package / Case 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package 54-SOIC
Base Product Number MC337
RoHS Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.31.0001
Standard Package 26
Contact Information
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