NXP USA Inc. MC33794EKR2

MC33794EKR2


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MC33794EKR2
  • Package: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
  • Datasheet: PDF
  • Stock: In stock
  • Description: MC33794EKR2(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series -
Package Tape & Reel (TR)
Product Status Obsolete
Type Sensor Interface
Input Type Logic
Output Type Logic
Current - Supply 7 mA
Operating Temperature -40°C ~ 85°C
Mounting Type Surface Mount
Package / Case 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package 54-SOIC-EP
Base Product Number MC337
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.31.0001
Standard Package 1,000
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