NXP USA Inc. MC33FS6500NAER2

MC33FS6500NAER2


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MC33FS6500NAER2
  • Package: 48-LQFP Exposed Pad
  • Datasheet: PDF
  • Stock: In stock
  • Description: MC33FS6500NAER2(Kg)

Details

Tags

Parameters
HTSUS 8542.39.0001
Other Names 935318679528
Standard Package 2,000
Mfr NXP USA Inc.
Series -
Package Tape & Reel (TR)
Product Status Active
Applications System Basis Chip
Current - Supply -
Voltage - Supply 1V ~ 5V
Operating Temperature -40°C ~ 125°C
Mounting Type Surface Mount
Package / Case 48-LQFP Exposed Pad
Supplier Device Package 48-HLQFP (7x7)
Base Product Number MC33FS6500
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
System Basis Chip PMIC 48-HLQFP (7x7)
Contact Information
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